What's New in Release 1.4.3:
- Over 30 different SOIC calculators and their associated families (see image below)
- Connector Calculators supporting complex connector types with variable grid patterns (see image)
- Numerous general enhancements based on user feedback

Overview
FootprintGen accurately automates the generation of complex PCB footprint (land pattern) models in a fraction of the time compared to typical manual methods. Both user-defined and the IPC-7351 standard settings are fully supported across a broad range of package types. These package types include BGA, CHIP, CHIPARRAY, DIP, LCC, LGA, PLCC, QFN, QFP, SOJ, and SOP with additional families continuing to be added.   

FootprintGen uses a GUI that allows you to see pads, leads, dimensioning, and more, all in one place. This eliminates the complicated, multi-window, process of building footprints without a specialized tool. It also increases accuracy as designers can see exactly how their changes affect the footprint. Designers can select from D-shape, oblong, or rectangular pad shapes, or they can customize a specific pad shape with rounding or champfering specifications. Pad stacks are user configurable and can be assigned to unique locations including corner pads or specific row/column positions.

FootprintGen integrates seamlessly with Cadence® OrCAD® and Allegro® PCB design solutions, complementing existing apps including SymbolGen. Using FootprintGen and SymbolGen, PCB footprint models can be verified and correlated to the schematic symbol models, immediately identifying any errors or discrepancies. The resulting workflow dramatically reduces design time and errors.